• Process development of chip, lens, fiber attachment methods using solder and epoxy.
• Process development of component attach methods using epoxy and/or solder
• Work closely with team members on conceptual design layout, vendor interaction, package prototyping, testing, and performance characterization
• Contributes to failure mode analysis (FMA) and qualification of product Perform data analysis utilizing DOE, SPC, and FMEA tools regularly throughout product life cycle
• Generates BOMs, assembly work instructions and engineering reports for new processes/products
• Transfers processes to contract manufacturers primarily in Asia
• Plan and execute on schemes to improve product yield and reliability
• Recommends and executes qualification tests for new processes/components