• Responsible for 800G/1.6T and above module-level MB or EVB test board, RF channel routing planning, PCB material selection and stack-up definition, pre-simulation, providing PCB RF design report to layout engineer.
• Responsible for 128Gbaud and above component-level EVB test board, connector selection, PCB material selection and stack-up definition, pre-simulation, providing PCB RF design report to layout engineer.
• Responsible for all RF simulation items of various projects, 3D EM modeling, RF optimization of each RF interface, passive channel simulation and full channel simulation with chip electrical models, post-simulation confirmation, and providing RF simulation report for cross-department review, some projects may have very tight schedules.
• Responsible for channel simulation of RF performance comparison for different chips or different parameter configurations in electrical models.
• Responsible for various EVB/MB/FPC performance confirmations by RF testing.
• Responsible for locating RF-related problems in each stage of product testing, cause investigations, including RMA.
• Cooperate with cross-departmental teams at different sites, communicate technical issues, and participate in the evaluation of project plans to ensure smooth completion.
• RF technical support for various platforms including RF technology communications with PCB/FPC/PKG/connector/chip vendors, RF technology improvement for new products with smaller signal pitch and higher bandwidth, new RF technology learning.

• Bachelor/Master or above in electronic information engineering, communication engineering, microwave technology or related majors, familiar with signal integrity theory and microwave theory.
• 5 years or above experience in high-speed optical-electronics products, experience in 800G/1.6T module MB simulation and optimization is preferred.
• Familiar with at least one 3D EM field solver tool (HFSS，CST, EMpro, and so on), able to independently complete 3D EM modeling and RF performance optimization.
• Familiar with at least one channel simulation solver tool (ADS, Circuit, and so on), able to independently connect channel simulation models and generate simulation results of different parameter configurations.
• Familiar with commonly used PCB materials including Dk/Df parameters and common process parameters of PCB manufacturing, able to independently complete PCB material selections and PCB stack-up definitions for different requirements of various projects, familiar with impedance calculation methods, and provide PCB stack-up and RF trace width and spacing to layout engineers and PCB manufacturers.
• Familiar with lab instruments such as TDR, PNA, Probe, and so on. Familiar with instrument calibration methods and S-parameter/TDR test data processing / analysis, able to complete RF test independently, experience in RF problem analysis and location is preferred.
• Able to independently do RF scheme evaluations of various projects, cross-departmental communications of RF, component placement, processing, mechanical, assembly, layout and other related technical issues between different sites, pre-simulation, post-simulation, make review reports and complete reviews.
• Fluent English in listening, speaking, reading and writing.